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PCB Manufacturing Capability
PCB Process Capability Table
| Item | Mass Production | Sample |
|---|---|---|
| Material | FR4/Ordinary Tg /High Tg /PI/ Low-k/Lead Free/Halogen Free/High Frequency/High Speed | FR4/Ordinary Tg /High Tg /PI/ Low-k/Lead Free/Halogen Free/High Frequency/High Speed/Ceramic/Metal Base/Glass Substrate |
| Type | HDI/Multilayer/FPC/Rigid-Flex/High Frequency/High Speed/Hybrids & Mixed Dielectrics | HDI/Multilayer/FPC/Rigid-Flex/High Frequency/High Speed/Hybrids & Mixed Dielectrics |
| Layer | 2-30 | 2-64 |
| Max HDI Stages | 4+N+4 | Any layer Interconnect |
| PCB Thickness | 0.2-6.0mm | 0.15-20mm |
| Copper Weight | 1/3-6OZ | 1/4-12OZ |
| Mechancial Drill Size（Min） | 6mil（0.15mm） | 5mil（0.127mm） |
| Microvia Hole Size （Min） |
4mil（0.1mm） | 3mil（0.076mm） |
| Trace width/Spacing（Min） | Inner layer2/2mil，Outer layer2.5/2.5mil | Inner layer1.8/1.8mil，Outer layer2/2mil |
| Panel Size （Max） |
800*600mm | 1050*610mm |
| Outline Tolerance （Min） |
±3mil（0.076mm） | 2mil（0.05mm） |
| BGA Pad （Min） |
8mil（0.2mm） | 7mil（0.18mm） |
| Through-Hole Aspect Ratio | 12:1 | 20:1 |
| Blind Via Aspect Ratio | 1:1 | 1:1.2 |
| Impedance Tolerance （Min） |
8%（Single-ended, Differential） | 5%（Single-ended, Differential） |
| Via to Inner Layer Trace Spacing （Min） |
6mil（0.15mm） | 5mil（0.127mm） |
| Level to Level Alignment （Min） |
3mil（0.076mm） | 2mil（0.05mm） |
| Special Process | VIP /Conductive Via Fill /Controlled Depth Drill and Rout/Cavity Boards /Back Drilling/Edge Plating/In‐board Beveling | VIP /Conductive Via Fill /Controlled Depth Drill and Rout/Cavity Boards /Back Drilling/Edge Plating/In‐board Beveling/Buried Capacitance |
| Surface Finishes | ENIG/OSP/HASL/Electric Gold Finger/Electric Hard Gold/Immersion Tin/Immersion Tin/ENIG+OSP/ENEPIG | ENIG/OSP/HASL/Electric Gold Finger/Electric Hard Gold/Immersion Tin/Immersion Tin/ENIG+OSP/ENEPIG |
Advanced PCB Manufacturing Capability
Season PCB’s PCB manufacturing capability encompasses a wide range of technologies and specifications designed to meet the demanding requirements of modern electronics. Our state-of-the-art facility in Shenzhen, China, is equipped with advanced equipment for HDI, multi-layer, high-frequency, and high-speed PCB production, making us a trusted partner for engineers worldwide.
Core PCB Manufacturing Capability Specifications
Layer Count Capability
Our PCB manufacturing capability supports 1 to 40 layers, including any-layer HDI constructions. Whether you need a simple double-sided board or a complex 40-layer backplane, our PCB manufacturing capability covers your requirements with precise layer-to-layer registration.
Fine Line Capability
We achieve minimum trace width and spacing of 0.05mm/0.05mm (2mil/2mil) using LDI (Laser Direct Imaging) technology. This PCB manufacturing capability enables high-density routing for advanced IC packages and fine-pitch BGA designs.
Impedance Control Capability
Our PCB manufacturing capability includes precise impedance control with tolerance of plus or minus 8% or better. We support single-ended 50 ohm, differential 100 ohm and 90 ohm, and custom impedance requirements, verified by TDR testing on every panel.
Material PCB Manufacturing Capability
Our PCB manufacturing capability includes processing FR-4 (Tg130 to Tg180), high-Tg materials (IT-180A, S1000-2), low-loss materials (Megtron 6/7, Tachyon 100G), Rogers RO4000 and RO3000 series, and flexible polyimide materials. This material versatility in our PCB manufacturing capability supports frequencies from DC to 100GHz.
Surface Finish PCB Manufacturing Capability
We offer ENIG, ENIPIG, HASL, Lead-free HASL, OSP, Immersion Silver, Immersion Tin, and Hard Gold surface finishes. Our PCB manufacturing capability ensures proper surface finish selection for each application’s solderability, shelf life, and contact requirements.
Contact Season PCB to discuss your specific PCB manufacturing capability requirements. Our engineering team will review your design and confirm our capability to meet your specifications.
Our PCB manufacturing capability also includes advanced via technologies: through-hole, blind via, buried via, and any-layer microvia. This comprehensive via capability in our PCB manufacturing capability supports complex HDI designs with high interconnection density.
PCB Manufacturing Capability Testing
Our PCB manufacturing capability includes comprehensive testing: 100% electrical testing, AOI inspection, X-ray inspection, and TDR impedance testing. These testing capabilities ensure every PCB meets our quality standards and customer specifications.
Season PCB continuously invests in expanding our PCB manufacturing capability to serve evolving customer needs. Contact us to discuss how our PCB manufacturing capability can support your next project.
Our PCB manufacturing capability is continuously upgraded to meet evolving industry demands. Season PCB invests in advanced equipment and training to expand our PCB manufacturing capability every year, ensuring we can handle the most challenging designs. Contact our engineering team to discuss how our PCB manufacturing capability can support your next project.
Our PCB manufacturing capability is benchmarked against IPC standards including IPC-6012 for rigid PCBs and IPC-6018 for microwave boards. These standards define the quality and capability levels that our PCB manufacturing capability consistently meets.
For more information about our manufacturing facility, visit our factory display page. To see our complete product range, browse PCB products. Learn about our PCB lead time for production planning.