Precision-Engineered 8-Layer Core PCB Samples

Accelerate your hardware validation with industry-grade 8-layer prototypes. Built for complex multilayer architectures, rigorous thermal stability, and flawless signal integrity.

ISO 9001 & ISO 14001 Certified Factory
IATF 16949 Automotive Quality Standard
UL & Rohs Certified

4-Layer Automotive PCB Manufacturing Specifications

Parameter	Specification	Advanced Capabilities
Layer Count	6Layer	2-32L(Mass); 2-64L(Sample)
Base Material	Fr-4.0 IT180A Tg170	SY, NY,TUC,ZY,EMC,KB,ITEQ, Rogers, Megtron , Nelco,Isola
Board Thickness	1.0mm	0.2-6.4mm(Mass);0.15-20mm(Sample)
Panel Size	83.2*68.4mm/10	800600mm(Mass);1050610(Sample)
Copper Thickness	Outer: 1 OZ Inner: 1 OZ	Outer: 1/3-12 OZ Inner: 1/4-12 OZ
Min Drill Size	0.2mm	0.15mm(Mass);0.127mm(Sample)
Min Trace Width/Spacing	4/4mil	2.5/2.5mil(1OZ) 2/2mil(HOZ)
Min BGA Pad	No	0.15mm
Surface Finish	ENIG 2U”+Electric Hard Gold 30U”	OSP,ENIG,HASL,Electric Hard Gold, ENIG+OSP,ENEPIG,mmersion Silver & Tin
pecialized Processes	POFV	Resin Plugged Vias,Copper Paste Via Filling, Copper Plating Via Filling
Solder Mask Color	Green	Green, Blue,Black,White,Yellow,Red,Pruple, Matte Green,Matte Blue,Matte Black
Impedance Control	±10% (50/85/100Ω)	±5% (Strict Tolerance)
Min Routing Tolerance	±0.15mm	±0.75mm
Quality Standard	IPC-Class 2 ,RoHS	IPC-Class 3,UL,Rohs,IATF16949,GJB
PCB Type	Multilayer	HDI,Multilayer,Rigid-Flex,High Frequency,High Speed,Hybrids & Mixed Dielectrics

Standard 6-Layer PCB Stackup for Optical Transceivers

A well-designed stackup is crucial for electromagnetic compatibility (EMC) and power integrity (PI). Here is our recommended high-speed 6-layer stackup configuration:

Layer 1 (Top): Signal Layer — Main high-speed trace routing and component placement. (1.57 mil, 1/3oz + Plating)
Layer 2: Ground Plane (GND) — Critical reference shield for Top Layer signals. (1.18mil, 1 oz)
Layer 3: Inner Signal 1 — Controlled impedance routing for internal buses. (1.18mil, 1oz)
Layer 4: Power Plane (PWR) — Dedicated low-impedance power distribution. (1.18mil, 1oz)
Layer 5: Ground Plane (GND) — Power isolation and inner signal reference. (1.18mil, 1oz)
Layer 6: Inner Signal 2 — Auxiliary internal routing. (1.18mil, 1oz)
Layer 7: Power / Ground Plane — Configurable according to power net complexity. (1.18mil, 1oz)
Layer 8 (Bottom): Signal Layer — Bottom routing and secondary components. (1.57mil, 1/3 oz + Plating)

High-Reliability 4-Layer Automotive PCB Stackup

If your original design does not meet the strict impedance requirements, don’t worry. Our engineering team will optimize it for you. The diagram below illustrates how we adjust the impedance traces on this 6-layer optical module PCB: