12-Layer 1-Step hdi pcb

10-layer-1-step-hdi-expedited-proofing-c

12-layer 1-step HDI

Layer Count: 12L(1+10+1)
Material: FR4 Tg170
Material: 1.2mm
Panel Size: 140*120mm/4
Outer Layer Copper Thickness: 1OZ
Inner Layer Copper Thickness: HOZ
Min Via Diameter: 0.20mm
Microvia Hole Size: 0.1mm
Trace Width/Spacing: 3/3mil
Min BGA Pad: 0.20mm
Surface Finish: ENIG1-2U’’
12-Layer 1-Step HDI core pcb,RK3588 core board, designed for industrial control applications.

12-Layer 1-Step HDI-pcb-c
12-Layer-1-Step HDI-pcb-s

12-layer 1-step hdi core pcb,The RK3588 Core Board is a processor module based on Rockchip’s RK3588 SoC, featuring an advanced 8-core 64-bit architecture combining Cortex-A76 and Cortex-A55 CPUs with a clock speed of up to 2.4GHz. Known for its high performance, low power consumption, multi-functionality, and robust stability, the RK3588 Core Board is ideal for a wide range of applications, including AI, smart home systems, industrial automation, and smart terminal devices.

RK3588 Core Board: A High-Performance, Low-Power, and Versatile Processing Solution

Introduction

The RK3588 Core Board is a cutting-edge processor module based on Rockchip’s RK3588 SoC, designed to deliver exceptional performance, energy efficiency, and versatility. Built on an advanced 8-core 64-bit architecture (Cortex-A76 + Cortex-A55) with a clock speed of up to 2.4GHz, this core board is engineered for applications ranging from artificial intelligence (AI) and smart home systems to industrial automation and smart terminals. Its 12-layer 1-step HDI PCB design ensures high stability and signal integrity, making it a reliable choice for demanding computing tasks.

This article explores the key features of the RK3588 Core Board, including its high performance, low power consumption, multifunctional capabilities, and strong stability, demonstrating why it is an ideal solution for modern embedded systems.

1. High-Performance Computing Power

The RK3588 Core Board stands out due to its superior processing capabilities, driven by its Cortex-A76 cores, which offer approximately 20% higher performance compared to the previous-generation Cortex-A73. The combination of four Cortex-A76 performance cores and four Cortex-A55 efficiency cores ensures an optimal balance between single-threaded speed and multi-core parallel processing.

Key Performance Enhancements:

  • Faster CPU & GPU Performance: The ARM Mali-G610 MP4 GPU enhances graphics rendering, making it suitable for AI vision processing and high-resolution displays.
  • Advanced Memory Support: Supports LPDDR4/LPDDR4X/LPDDR5, enabling high-speed data access while maintaining low power consumption.
  • High-Speed Storage Options: Compatible with eMMC 5.1 and eMMC 4.5, ensuring rapid boot times and efficient data storage.

These features make the RK3588 Core Board ideal for AI edge computing, 4K video processing, and real-time industrial control systems, where high-speed data handling is critical.

2. Energy-Efficient Design for Extended Operation

One of the most significant advantages of the RK3588 Core Board is its low power consumption, making it suitable for battery-powered and energy-sensitive applications.

Power Optimization Technologies:

  • Improved Cortex-A76 Efficiency: Compared to the Cortex-A73, the A76 cores deliver 20% lower power consumption at similar performance levels.
  • Advanced Power Management Unit (PMU): Dynamically adjusts voltage and frequency to minimize energy waste.
  • Low-Power Interfaces: Features like Digital Audio Interface (I2S) and optimized peripheral controllers reduce idle power draw.

Applications Benefiting from Low Power Consumption:

  • Smart Home Devices: Long-lasting operation for voice assistants and security systems.
  • Portable & IoT Devices: Extended battery life for handheld terminals and sensors.
  • Industrial Automation: Reduced thermal footprint for fanless embedded systems.

By integrating these power-saving technologies, the RK3588 Core Board ensures longer uptime and lower operational costs without sacrificing performance.

3. Multifunctional Connectivity for Diverse Applications

The RK3588 Core Board supports a wide range of interfaces and multimedia capabilities, making it adaptable to various use cases.

Key Connectivity Features:

Video & Display Support:
  • HDMI 2.0: Enables 4K@60Hz output for high-resolution displays.
  • MIPI-DSI: Supports touchscreen integration in industrial HMIs and tablets.
  • CVBS: Legacy video output for older display systems.
Audio & Voice Processing:
  • I2S & PCM Interfaces: High-fidelity audio for voice recognition and playback.
  • Built-in DSP Support: Enhances noise cancellation and far-field microphone processing.
Expansion & Networking:
  • Gigabit Ethernet: Reliable wired networking for industrial applications.
  • USB 3.0/2.0, SPI, I2C, UART: Enables seamless peripheral integration.

This versatile I/O configuration allows the RK3588 Core Board to serve as the backbone for AI-powered cameras, digital signage, robotics, and medical devices.

4. Robust Stability for Mission-Critical Systems

Reliability is a crucial factor in embedded computing, and the RK3588 Core Board is designed for long-term stability under demanding conditions.

Enhanced Stability Features:

  • 12-Layer 1-Step HDI PCB: Improves signal integrity and reduces EMI interference.
  • Multiple Boot Options: Supports NAND Flash, SD/eMMC, ensuring flexible firmware deployment.
  • Wide OS Compatibility: Runs Linux, Android, and other RTOS, allowing customization for different industries.

Industries That Benefit from High Stability:

  • Industrial Automation: Resistant to vibration and temperature fluctuations.
  • AI Edge Computing: Consistent performance in 24/7 inference tasks.
  • Medical & Automotive Electronics: Meets high-reliability standards.

Conclusion: A Future-Ready Embedded Solution

The RK3588 Core Board is a high-performance, energy-efficient, and highly adaptable processing platform suitable for AI, smart devices, industrial control, and IoT applications. With its Cortex-A76/A55 architecture, advanced power management, rich I/O options, and rugged design, it provides a scalable and reliable foundation for next-generation embedded systems.

As technology continues to evolve, the RK3588 Core Board is poised to play a pivotal role in emerging fields such as autonomous machines, AR/VR, and 5G edge computing, solidifying its position as a leading embedded processing solution.

12-layer 1-step HDI PCBs are widely used in high-end applications such as AI systems, commercial displays, and communication modules. Season Multilayer Circuit possesses specialized expertise in 12-layer 1-step HDI technology and has provided such products to numerous clients.

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